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32G Industrial Embedded System 900-13701-0040-000

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32G Industrial Embedded System 900-13701-0040-000

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Brand Name : PLINK

Model Number : Y-C8-DEV-Orin32

Place of Origin : China

MOQ : 1

Price : To be discussed

Payment Terms : L/C, D/A, D/P, T/T

Supply Ability : 1+set+4weeks

Delivery Time : 15-30 work days

Packaging Details : 195mm × 180mm × 50mm

NAME : NVIDIA AI Kit Industrial Embedded System Jetson AGX Orin Developer Kit development Board 32G 900-13701-0040-000

Keyword : NVIDIA AI Kit Industrial Embedded System Jetson AGX Orin Developer Kit development Board 32G 900-13701-0040-000

Memory : 32GB 256-bit LPDDR4 x 136.5GB/s

AI Perf : 200 TOPS

DL Accelerator : 2x NVDLA v2

Single Package Size : 188mm × 170mm × 43mm

Input Power : DC +12V

Temperature Range : -25℃ to 65℃

GPIO(3.3V) *1 : *1

RS 232 : *2

Vision Accelerator : 1x PVA v2

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NVIDIA AI Kit Industrial Embedded System Jetson AGX Orin Developer Kit development Board 32G 900-13701-0040-000

NVIDIA Jetson AGX Orin Developer Kit Y-C8 AGX Orin module 32G 900-13701-0040-000

The Y-C8-DEV-Orin 32G is self-developer kit by PLINK-AI,and it based on NVIDIA Jetson AGX Orin module, Jetson AGX Orin Module SOM Up To 200 TOPS of AI performance 900-13701-0040-000 and it is for industrial such as autonomous, VR, drones, robotics and logistics. NVIDIA Jetson AGX Orin module (900-13701-0040-000) with the Ampere GPU architecture, next-generation deep learning and vision accelerators, high-speed IO, and fast memory bandwidth. and gives you more than 6X the performance of Jetson AGX Xavier in the same compact form-factor for robotics and other autonomous machine use cases.

Jetson AGX Orin 32G domestic developer kit

Y-C8 development Board + NVIDIA Jetson AGX Orin Module (32G) 900-13701-0040-000 + Cooling FAN

NVIDIA Jetson AGX Orin Module (32G) Technical Specifications

AI Perf

200 TOPS

GPU

1,792-core NVIDIA Ampere architecture GPU with 56 Tensor Cores

CPU

8-core Arm® Cortex®-A78AE v8.2 64-bit CPU
2MB L2 + 4MB L3

Memory

32GB 256-bit LPDDR5
204.8GB/s

Storage

64GB eMMC 5.1

USB

3x USB 3.2 Gen2 (10 Gbps)
4x USB 2.0

Camera

Up to 6 cameras (16 via virtual channels)
16 lanes MIPI CSI-2
D-PHY 2.1 (up to 40Gbps) | C-PHY 2.0 (up to 164Gbps)

Display

1x 8K60 multi-mode DP 1.4a (+MST)/eDP 1.4a/HDMI 2.1

USB Micro-B

1 x Type B (OTG)

USB Type-A

1 x USB 3.1

GPIO(3.3V)

1

SPI(3.3V)

1

I2C(3.3V)

2

RS 232

2

Debug(UART)

1

CAN (with on-board transceiver)

2

Networking

1 x 10/100/1000 Ethernet/RJ45

Power Supply

DC +12V

Temperature

-25~+65°C

Size

188mm × 170mm × 43mm

32G Industrial Embedded System 900-13701-0040-000


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32G Industrial Embedded System

      

900-13701-0040-000 Industrial Embedded System

      
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